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NCN1154 DP3T USB 2.0 High Speed / Audio Switch with Negative Swing Capability
The NCN1154 is a DP3T switch for combined true-ground audio, USB 2.0 high speed data, and UART applications. It allows portable systems to use a single port to pass either USB data or audio signals from an external headset. The switch is capable of passing signals with negative voltages as low as 2 V below ground. The NCN1154 features shunt resistors on the audio ports. These resistors are switched in when the audio channel is off and provide a safe path to ground for any charge that may build up on the audio lines. This reduces Pop & Click noise in the audio system. The device has an extended VCC range which can operate off VCC up to 4.2 V while passing true ground audio signals down to -2 V.
Features http://onsemi.com MARKING DIAGRAM
1 UQFN12 MU SUFFIX CASE 523AE ACM G
USB Connector
* * * * * * * * *
480 Mbps High Speed USB Capable Capable of Passing Negative Swing Signals Down to -2 V 1.8 V Compatible Control Pins for 2.7 V v VCC v 4.2 V High USB Path Bandwidth (850 MHz) USB/Audio/UART Audio Channel Shunt Resistors for Pop & Click Noise Reduction Ultra Low THD in Audio Mode: 0.01% into 16 W Load 5.25 V Tolerant Common Pins This is a Pb-Free Device
AC = Specific Device Code M = Date Code G = Pb-Free Package
APPLICATION DIAGRAM
NCN1154 D+ D- Rx Tx UART XCVR HS USB XCVR
COM+ COM-
Typical Applications
* Shared USB/UART/Audio Connector * Mobile Phones * Portable Devices
IN1, IN2
R L
True GND Audio
From Baseband
ORDERING INFORMATION
Device NCN1154MUTAG Package Shipping UQFN12 3000 / Tape & Reel (Pb-Free)
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
(c) Semiconductor Components Industries, LLC, 2010
June, 2010 - Rev. 1
1
Publication Order Number: NCN1154/D
NCN1154
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VCC D+ D- TX RX L R VCC 3 9 GND D+ COM- COM+
L IN1
1
12
11
Tx
2
10
COM+
Control Logic
IN1
Rx
4
8
COM-
D-
5
6 R
7
IN2
GND
IN2
(Top View)
Figure 1. Functional Block Diagram PIN DESCRIPTIONS
Pin # 1 2 3 4 5 6 7 8 9 10 11 12 Name D+ Tx VCC Rx D- R IN2 COM- GND COM+ IN1 L Direction I/O I/O Power I/O I/O I/O Input I/O Power I/O Input I/O Positive Data Line for USB Signals Transmit Data Line for UART Signals Power Supply Receive Data Line for UART Signals Negative Data Line for USB Signals Right Line for Audio Signals Control Input Select Line
Figure 2. Pinout Diagram
Description
Right Audio / Negative Data Common Line Ground Left Audio / Positive Data Common Line Control Input Select Line Right Line for Audio Signals
TRUTH TABLE
IN1 0 0 1 1 IN2 0 1 0 1 D+, D- Hi Z ON Hi Z Hi Z RX/TX Hi Z Hi Z Hi Z ON L, R Hi Z Hi Z ON Hi Z L, R SHUNT ON ON OFF ON
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OPERATING CONDITIONS
MAXIMUM RATINGS
Symbol VCC VIS Pins VCC D+ to COM+, D- to COM- L to COM+, R to COM- Tx to COM+, Rx to COM- VIS VIN ICC TS IIS_CON IIS_PK IIN COM+, COM-, R, L, D+, D-, Rx, Tx COM+, COM-, R, L, D+, D-, Rx, Tx IN1, IN2 COM+, COM- IN1, IN2 VCC DC Signal Voltage Tolerance (<24 hours) Control Input Voltage Positive DC Supply Current Storage Temperature Analog Signal Continuous Current-Closed Switch Analog Signal Continuous Current 10% Duty Cycle Control Input Current Parameter Positive DC Supply Voltage Analog Signal Voltage Value -0.5 to +6.0 -0.5 to +6.0 -2.5 to VCC + 0.5 -2.5 to VCC + 0.5 5.25 -0.5 to +6.0 50 -65 to +150 $100 $500 1.0 V V mA C mA mA mA Unit V V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. NOTE: These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage.
RECOMMENDED OPERATING CONDITIONS
Symbol VCC VIS Pins VCC D+ to COM+, D- to COM- L to COM+, R to COM- Tx to COM+, Rx to COM- VIN TA IN1, IN2 Control Input Voltage Operating Temperature Parameter Positive DC Supply Voltage Analog Signal Voltage Min 2.7 GND -2.0 GND GND -40 Max 5.0 VCC VCC VCC VCC +85 V C Unit V V
Minimum and maximum values are guaranteed through test or design across the Recommended Operating Conditions, where applicable. Typical values are listed for guidance only and are based on the particular conditions listed for section, where applicable. These conditions are valid for all values found in the characteristics tables unless otherwise specified in the test conditions.
DC ELECTRICAL CHARACTERISTICS
CONTROL INPUT Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical values
are referenced to TA = +25C, VCC = 3.3 V. Symbol VIH VIL IIN Pins IN1, IN2 -40C to +85C Parameter Control Input HIGH Voltage Test Conditions VCC (V) 2.7 3.3 4.2 2.7 3.3 4.2 0 VIS VCC Min 1.3 1.4 1.5 - Typ - Max - Unit V
IN1, IN2
Control Input LOW Voltage
-
0.4 0.4 0.4 50
V
IN1, IN2
Current Input Leakage Current
-
-
nA
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SUPPLY CURRENT AND LEAKAGE Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise
noted). Typical values are referenced to TA = +25C, VCC = 3.3 V. Symbol INC,NO(OFF) ICOM(ON) ICC IOFF Pins D+, D- R, L Tx, Rx COM-, COM+ VCC COM-, COM+ Parameter OFF State Leakage -40C to +85C Test Conditions VCOM-, VCOM+ = 0 V, 4.2 V VD+, VD- = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V VCOM-, VCOM+ = 0 V, 4.2 V VD+, VD- = 4.2 V, 0 V or float VL, VR = float or 4.2 V, 0 V VIS = GND to VCC; ID = 0 A 0 VIS 5.0 V VCC (V) 4.2 Min Typ Max 80 100 21 35 50 Unit nA
ON State Leakage
4.2
nA
Quiescent Supply Power OFF Leakage
4.2 0
mA mA
USB ON RESISTANCE Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical
values are referenced to TA = +25C, VCC = 3.3 V. Symbol RON RFLAT DRON Pins D+ to COM+ D- to COM- D+ to COM+ D- to COM- D+ to COM+ D- to COM- -40C to +85C Parameter On-Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC ION = 10 mA VIS = 0 V to VCC ION = 10 mA VIS = 0 V to VCC VCC (V) 2.7 3.3 4.2 2.7 3.3 4.2 2.7 3.3 4.2 Min Typ 5.5 5.5 5.5 0.08 0.08 0.08 0.03 0.03 0.03 Max 7.5 7.5 7.5 Unit W W W
On-Resistance Flatness
On-Resistance Matching
AUDIO ON RESISTANCE Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical
values are referenced to TA = +25C, VCC = 3.3 V. Symbol RON RFLAT DRON RSH Pins R to COM+ L to COM- R to COM+ L to COM- R to COM+ L to COM- L, R -40C to +85C Parameter On-Resistance Test Conditions ION = 10 mA VIS = -1.5 to 1.5 ION = 10 mA VIS = -1.5 to 1.5 ION = 10 mA VIS = -1.5 to 1.5 ION = 10 mA VCC (V) 2.7 3.3 4.2 2.7 3.3 4.2 2.7 3.3 4.2 2.7 - 4.2 Min Typ 3.0 3.0 3.0 0.11 0.11 0.11 0.03 0.03 0.03 118 160 Max 4.7 4.7 4.7 Unit W W W W
On-Resistance Flatness
On-Resistance Matching
Shunt Resistance (Resistor + Switch)
UART ON RESISTANCE Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical
values are referenced to TA = +25C, VCC = 3.3 V. Symbol RON RFLAT DRON Pins Tx to COM+ Rx to COM- Tx to COM+ Rx to COM- Tx to COM+ Rx to COM- -40C to +85C Parameter On-Resistance Test Conditions ION = 10 mA VIS = 0 V to VCC ION = 10 mA VIS = 0 V to VCC ION = 10 mA VIS = 0 V to VCC VCC (V) 2.7 3.3 4.2 2.7 3.3 4.2 2.7 3.3 4.2 Min Typ 5.5 5.5 5.5 0.08 0.08 0.08 0.03 0.03 0.03 Max 7.5 7.5 7.5 Unit W W W
On-Resistance Flatness
On-Resistance Matching
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AC ELECTRICAL CHARACTERISTICS
TIMING/FREQUENCY Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical values are referenced to TA = +25C, VCC = 3.3 V. RL = 50 W, CL = 35 pF, f = 1 MHz.
-405C to +855C Symbol tON tOFF TBBM BW Pins Parameter Turn-ON Time (Closed to Open) Turn-OFF Time (Closed to Open) Break-Before-Make Time D+ to COM+ -3 dB Bandwidth D- to COM- CL = 5 pF RS = 50 W Test Conditions VCC (V) Min Typ 15 67 11 850 Max Unit ms ns ms MHz
ISOLATION Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical values are referenced to TA = +25C, VCC = 3.3 V. RL = 50 W, CL = 5 pF.
-405C to +855C Symbol OIRR XTALK THD+N Pins Open COM+ to COM- Parameter OFF-Isolation Non-Adjacent Channel Crosstalk Total Harmonic Distortion + Noise Test Conditions f = 100 kHz, RS = 50 W f = 100 kHz, RS = 50 W IN1, IN2 = 3.0 V f = 20 Hz to 20 kHz VCOM = 0.5 Vpp RL = 600 W f = 10 kHz RCOM = 50 W 3.0 VCC (V) Min Typ -81 -93 0.001 Max Unit dB dB %
PSRR
Power Supply Rejection Ratio
3.0
60
dB
CAPACITANCE Min and Max apply for TA between -40C to +85C and TJ up to +125C (Unless otherwise noted). Typical values are
referenced to TA = +25C, VCC = 3.3 V. RL = 50 W, CL = 5 pF, f = 1 MHz. -405C to +855C Symbol CIN CON CON COFF Pins IN1, IN2 Parameter Control Pin Input Capacitance Test Conditions VCC = 0 V Min Typ 2.0 9.0 8.5 3.5 Max Unit pF pF pF pF
D+, Tx to COM+ USB, UART ON Capacitance D-, Rx to COM- R to COM+ L to COM- D+, D- Tx, Rx Audio ON Capacitance USB, UART OFF Capacitance
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TABLE OF GRAPHS
Symbol NE FE Near End Signaling Eye Diagram Far End Signaling Eye Diagram Parameter Figure 3, 4, 5, 6 7, 8, 9, 10
Figure 3. Reference Near End Eye Diagram (Path Trough Dedicated Line, Temp = 255C)
Figure 4. USB Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 5. UART Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C)
Figure 6. Audio Switch Near End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C)
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Figure 7. Reference Far End Eye Diagram (Path Trough Dedicated Line, Temp = 255C)
Figure 8. USB Switch Far End Eye Diagram (VCC = 3.6V, IN1 = 0, IN2 = 1, Temp = 255C)
Figure 9. UART Switch Far End Eye Diagram (Vcc = 3.6 V, IN1 = 1, IN2 = 1, Temp = 255C)
Figure 10. Audio Switch Far End Eye Diagram (VCC = 3.6 V, IN1 = 1, IN2 = 0, Temp = 255C)
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PACKAGE DIMENSIONS
UQFN12 1.7x2.0, 0.4P CASE 523AE-01 ISSUE A
NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. DIMENSION b APPLIES TO PLATED TERMINAL AND IS MEASURED BETWEEN 0.15 AND 0.30 MM FROM TERMINAL TIP. 4. MOLD FLASH ALLOWED ON TERMINALS ALONG EDGE OF PACKAGE. FLASH 0.03 MAX ON BOTTOM SURFACE OF TERMINALS. 5. DETAIL A SHOWS OPTIONAL CONSTRUCTION FOR TERMINALS. DIM A A1 A3 b D E e K L L1 L2 MILLIMETERS MIN MAX 0.45 0.55 0.00 0.05 0.127 REF 0.15 0.25 1.70 BSC 2.00 BSC 0.40 BSC 0.20 ---0.45 0.55 0.00 0.03 0.15 REF
D
PIN 1 REFERENCE
AB L1 DETAIL A
NOTE 5
2X 2X
0.10 C 0.10 C
0.05 C
12X
0.05 C A3
8X
K
5 7
DETAIL A
1 12X
L L2
BOTTOM VIEW
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative
EE EE EE
TOP VIEW A A1 SIDE VIEW e
11
E
DETAIL B OPTIONAL CONSTRUCTION
DETAIL B
C
SEATING PLANE
MOUNTING FOOTPRINT SOLDERMASK DEFINED
2.00
12X
b 0.10 0.05
M M
CAB C
NOTE 3
1 0.32 2.30
11X
0.40 PITCH
0.22
12X
0.69
DIMENSIONS: MILLIMETERS
*For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
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